Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.2
1.1
1.0
* Notes :
1. VGS = 0 V
0.9
* Notes :
1. VGS = 10 V
2. ID = 34.5 A
2. ID = 250µA
0.8
-100
-50
0
50
100
150
200
-100
-50
0
50
100
150
200
TJ, Junction Temperature [°C]
TJ, Junction Temperature [°C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
103
80
70
60
50
40
30
20
10
0
10 µs
100 µs
102
101
100
10-1
10-2
1ms
10ms
100ms
DC
Operation in This Area
is Limited by R DS(on)
* Notes :
1. TC = 25 o
2. TJ = 150 o
C
C
3. Single Pulse
100
101
102
25
50
75
100
125
150
TC, Case Temperature [oC]
VDS, Drain-SourceVoltage[V]
Figure 11. Transient Thermal Response Curve
100
D=0.5
10-1
0.2
0.1
PDM
t1
t2
0.05
* Notes :
10-2
0.02
0.01
1. ZθJC(t) = 0.26 0C/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
single pulse
10-3
10-5
10-4
10-2
10-1
100
101
t1, Square Wave Pulse Duration [sec]
4
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FDA69N25 Rev. A
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
