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ES29BDS160FB-12TG 参数 Datasheet PDF下载

ES29BDS160FB-12TG图片预览
型号: ES29BDS160FB-12TG
PDF下载: 下载PDF文件 查看货源
内容描述: 16兆( 2M ×8 / 1M ×16 )的CMOS 3.0伏只,引导扇区闪存 [16Mbit(2M x 8/1M x 16) CMOS 3.0 Volt-only, Boot Sector Flash Memory]
分类和应用: 闪存
文件页数/大小: 54 页 / 708 K
品牌: EXCELSEMI [ EXCEL SEMICONDUCTOR INC. ]
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E S I  
E S I  
Excel Semiconductor inc.  
PHYSICAL DIMENSIONS  
48-Ball FBGA (6 x 8 mm)  
0.20  
(4x)  
D1  
A
D
H
G F  
E
D
C
B
A
6
5
4
7
SE  
e
E
E1  
3
2
1
6
b
7
SD  
B
A1 CORNER INDEX MARK 11  
PIN 1 ID.  
0.15 M Z A B  
0.08 M Z  
10  
//  
0.25  
Z
A2  
A
0.08  
Z
Z
A1  
NOTES:  
PACKAGE  
JEDEC  
xFBD 048  
N/A  
1. Dimensioning and tolerancing per ASME Y14.5M-1994  
2. All dimensions are in millimeters.  
6.00 mm x8.00 mm PACKAGE  
3. Ball position designation per JESD 95-1, SPP-010.  
4. e represents the solder ball grid pitch.  
5. Symbol “MD” is the ball row matrix size in the “D” direction.  
Symbol “ME” is the ball column matrix size in the “E” direct-  
ion. N is the maximum number of solder balls for matrix si-  
ze MD X ME.  
SYMBOL  
A
MIN  
NOM  
MAX  
1.10  
NOTE  
OVERALL THICK  
NESS  
A1  
A2  
D
0.21  
0.7  
0.25  
0.76  
0.29  
0.82  
BALL HEIGHT  
BODY THICKNESS  
BODY SIZE  
8.00 BSC  
6. Dimension b” is measured at the maximum ball diameter  
in a plane parallel to datum Z.  
E
6.00 BSC  
5.60 BSC  
4.00 BSC  
8
BODY SIZE  
D1  
E1  
MD  
BALL FOOTPRINT  
BALL FOOTPRINT  
7. SD and SE are measured with respect to datums A and B  
and define the position of the center solder ball in the out-  
er row. When there is an odd number of solder balls in the  
outer row parallel to the D or E dimension, respectively, SD  
or SE = 0.000 when there is an even number of solder balls  
in the outer row, SD or SE = e/2  
8. “X” in the package variations denotes part is outer qualifi-  
cation.  
9. “+” in the package drawing indicate the theoretical center  
of depopulated balls.  
ROW MATRIX SIZED  
DIRECTION  
ME  
6
ROW MATRIX SIZED  
DIRECTION  
N
48  
TOTAL BALL COUNT  
BALL DIAMETER  
BALL PITCH  
b
0.30  
0.35  
0.40  
0.80 BSC  
0.40 BSC  
e
SD / SE  
SOLDER BALL  
PLACEMENT  
10. For package thickness A is the controlling dimension.  
11. A1 corner to be indentified by chamfer, ink mark, metalli-  
zed markings indention or other means.  
49  
Rev. 1C Jan 5 , 2006  
ES29LV160D  
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