E S I
E S I
ADVANCED INFORMATION
Excel Semiconductor inc.
CS#
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
28 29 30 31
SCK
SI
Instruction
1
0
0
1
1
1
1
1
Manufacturer Identification
Device Identification
High Impedance
SO
13
2
0
15 14
1
MSB
Figure 11. Read Identification (RDID) Instruction Sequence and Data-Out Sequence
Read Manufacturer ID & Device ID
(RDMD)
The instruction is initiated by driving the CS# pin low
The Read Manufacturer ID & Device ID (RDMD)
and shift the instruction code “90h” followed by three
instruction is an alternative to the Release from
dummy bytes. After which, the Manufacturer ID for
Power-down/Device ID instruction that provides both
ESI (4Ah) and the Device ID (13h) are shifted out on
the JEDEC assigned manufacturer ID and the spe-
the falling edge SCLK with most significant bit (MSB)
cific device ID.
first as shown in Figure 12. The Manufacturer and
Device IDs can be read continuously, alternating
The Read Manufacturer ID & Device ID (RDMD)
from one to the other. The instruction is completed
instruction is very similar to the Release from Power-
by driving CS# pin.
down/Device ID instruction.
CS#
0
1
2
3
4
5
6
7
8
9
10
28 29 30 31 32 33 34 35 36 37 38 39
SCK
SI
3 Dummy bytes
Instruction
21
3
1
0
23 22
2
1
0
0
1
0
0
0
0
MSB
Manufacturer ID
Device ID
High Impedance
7
5
4
3
1
0
6
2
7
SO
MSB
Figure 12. Read Manufacturer ID & Device ID (RDMD) Instruction Sequence and
Data-Out Sequence
17
Rev. 0D May, 11, 2006
ES25P80
EXCELSEMI [ EXCEL SEMICONDUCTOR INC. ]
