The Human Body Model has been the
generally accepted ESD testing method
for semiconductors. This method is also
specified in MIL-STD-883, Method 3015.7
for ESD testing. The premise of this ESD
testistosimulatethehumanbody’spotential
to store electro-static energy and discharge
it to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 9. This method will test the IC’s
capabilitytowithstandanESDtransientdur-
ing normal handling such as in manufactur-
ing areas where the ICs tend to be handled
frequently. The IEC-ꢀ000-4-2, formerly
IEC801-2, is generally used for testing ESD
on equipment and systems.
For system manufacturers, they must guar-
antee a certain amount of ESD protection
since the system itself is exposed to the
outside environment and human presence.
The premise with IEC1000-4-2 is that the
system is required to withstand an amount
of static electricity when ESD is applied to
points and surfaces of the equipment that
are accessible to personnel during normal
usage. The transceiver IC receives most
of the ESD current when the ESD source is
applied to the connector pins. The test cir-
cuit for IEC1000-4-2 is shown on Figure 10.
There are two methods within IEC1000-4-2,
the Air Discharge method and the Contact
Discharge method.
R
S
R
C
SW1
SW2
Device
Under
Test
C
DC Power
Source
S
Figure 9. ESD Test Circuit for Human Body Model
Contact-Discharge Model
R
R
R
C
S
V
SW1
SW2
Device
Under
Test
C
DC Power
Source
S
and
add up to 330Ω for IEC1000-4-2.
R
V
R
S
Figure 10. ESD Test Circuit for IEC1000-4-2
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8
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