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4450HG/3-K 参数 Datasheet PDF下载

4450HG/3-K图片预览
型号: 4450HG/3-K
PDF下载: 下载PDF文件 查看货源
内容描述: [Microprocessor, CMOS, PBGA324, ROHS COMPLIANT, HSBGA-324]
分类和应用: 外围集成电路
文件页数/大小: 92 页 / 780 K
品牌: EXAR [ EXAR CORPORATION ]
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I Document Changes/Revisions  
Documentation Changes include additions, deletions, and modifications made to this  
document. This section identifies the changes made in each release of the document.  
I.1 Document Revision A  
Initial Release.  
I.2 Document Revision B  
Update 1.  
Update 2.  
Acronym Section: Deleted duplicate acronyms, added TLS.  
Chapter 1: Slight revision and clean-up. Changed SA support from 300 to  
250.  
Update 3.  
Chapter 2: Minor editorial revisions. Changed SA support from 300 to 250  
in Section 2.2.  
Update 4.  
Update 5.  
Chapter 3 Section 3.1: Changed IPSec Performance from 2.1 to 2.0.  
Chapter 4: Slight revision and clean-up. Added details on Post Crypto  
Processor to Table 5. Section 4.4 updated to more accurately reflect clock  
domains.  
Update 6.  
Update 7.  
Chapter 5: Minor editorial revisions.  
Chapter 6: Major update. Added connection diagrams for each GMAC and  
SDRAM interface. Updated details on GPIO functionality and pin usage.  
Update 8.  
Update 9.  
Chapter 7: Major update. Modified DC Characteristics for each interface,  
GMAC, SDRAM, GPIO.  
Chapter 9: Modified a[13] to a[13]\cke and ba[2] to ba[2]\cke.  
I.3 Document Revision C  
Update 1.  
All sections: removed references to optional DDR memory.  
Update 2.  
Update 3.  
Section 4.1 Chip Architecture: replaced Block Diagram.  
Section 6.2.1.2 Connection drawings: added signal names to Host Side and  
moved hx_clk_0.  
Update 4.  
Update 5.  
Section 6.5 PLL Interface, Table 21: Description for pll_ref_clk added “or  
125MHz ref clock”; pll_mode[1] now only selects between the 25 and  
125MHz input ref clock.  
Section 6.7 General Purpose Pins, Table 22: changed reset function of  
dpu_gpio[4] and dpu_gpio[3] to ddr_config1 and ddr_config0. DDR  
Configuration section rewritten to reflect changes in DDR memory. Added  
Table 24 DDR2 Memory Configuration Sizing.  
Update 6.  
Update 7.  
Section 6.9 Power and Ground Pins: removed 2.5V(DDR1) from vddr; added  
vdds, corrected vref_ddr[2:0] to 0.9V for DDR2; added description for  
vttn_serdes and vtth_serdes; deleted vdda_srefbuf.  
Section 7.5 Power Sequencing: added second paragraph further describing  
the required power sequence.  
4450 – Data Sheet, DS-0131-06  
Page88  
Hifn Confidential