PCB design and manufacturing
Rework
following information is given as a guideline in such cases to increase the chances of success during
rework, though the warranty is still voided.
The module may be removed from the OEM PCB by the use of a hot air rework station, or hot plate.
Care should be taken not to overheat the module. During rework, the module temperature may rise
above its internal solder melting point and care should be taken not to dislodge internal components
from their intended positions.
XBee/XBee-PRO S2C 802.15.4 RF Module User Guide
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ETC [ ETC ]
