PCB design and manufacturing
Flux and cleaning
Flux and cleaning
We recommend that you use a “no clean” solder paste in assembling these devices. This eliminates
the clean step and ensures that you do not leave unwanted residual flux under the device where it is
difficult to remove. In addition:
n
Cleaning with liquids can result in liquid remaining under the device or in the gap between the
device and the host PCB. This can lead to unintended connections between pads.
n
The residual moisture and flux residue under the device are not easily seen during an
inspection process.
Rework
CAUTION! Any modification to the device voids the warranty coverage and certifications.
Rework should never be performed on the module itself. The module has been optimized to give the
best possible performance, and reworking the module itself will void warranty coverage and
certifications. We recognize that some customers will choose to rework and void the warranty; the
XBee/XBee-PRO S2C 802.15.4 RF Module User Guide
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ETC [ ETC ]
