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M13S64164A_09 参数 Datasheet PDF下载

M13S64164A_09图片预览
型号: M13S64164A_09
PDF下载: 下载PDF文件 查看货源
内容描述: 1M ×16位×4银行双倍数据速率SDRAM [1M x 16 Bit x 4 Banks Double Data Rate SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 48 页 / 1552 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M13S64164A  
DC Specifications  
Version  
Parameter  
Symbol  
Test Condition  
Unit Note  
-6  
-5  
Operation Current  
(One Bank Active)  
tRC = tRC (min), tCK = tCK (min),  
Active – Precharge  
IDD0  
110  
100  
mA  
Burst Length = 2, tRC = tRC (min),  
CL= 2.5, IOUT = 0mA,  
Active-Read-Precharge  
Operation Current  
(One Bank Active)  
IDD1  
IDD2P  
IDD2N  
130  
10  
110  
10  
mA  
mA  
mA  
Precharge Power-down  
Standby Current  
CKE VIL(max), tCK = tCK (min),  
All banks idle  
CKE VIH(min), CS VIH(min),  
tCK = tCK (min)  
Idle Standby Current  
70  
70  
Active Power-down Standby  
Current  
All banks ACT, CKE VIL(max),  
IDD3P  
IDD3N  
IDD4R  
20  
90  
15  
80  
mA  
mA  
mA  
tCK = tCK (min)  
One bank; Active-Precharge,  
Active Standby Current  
t
RC = tRAS(max), tCK = tCK (min)  
Burst Length = 2, CL= 2.5 ,  
tCK = tCK (min), IOUT = 0mA  
Operation Current (Read)  
180  
160  
Burst Length = 2, CL= 2.5 ,  
tCK = tCK (min)  
Operation Current (Write)  
IDD4W  
180  
160  
mA  
Auto Refresh Current  
Self Refresh Current  
IDD5  
IDD6  
140  
5
120  
5
mA  
mA  
tRC tRFC(min)  
CKE 0.2V  
1
Operation Current  
(4 bank interleaving)  
Burst Length = 4, tRC = tRC (min),  
IOUT = 0mA  
IDD7  
235  
215  
mA  
Note: 1. Enable on-chip refresh and address counters.  
AC Operation Conditions & Timing Specification  
AC Operation Conditions  
Parameter  
Symbol  
VIH(AC)  
VIL(AC)  
VID(AC)  
Min  
Max  
Unit  
V
Note  
Input High (Logic 1) Voltage, DQ, DQS and DM signals  
Input Low (Logic 0) Voltage, DQ, DQS and DM signals  
VREF + 0.31  
VREF - 0.31  
VDDQ+0.6  
V
0.7  
V
1
2
Input Different Voltage, CLK and CLK inputs  
VIX(AC)  
0.5*VDDQ-0.2 0.5*VDDQ+0.2  
V
Input Crossing Point Voltage, CLK and CLK inputs  
Note1. VID is the magnitude of the difference between the input level on CLK and the input on CLK .  
2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the  
same.  
Input / Output Capacitance  
(VDD = 2.3V~2.7V, VDDQ=2.3V~2.7V, TA = 25°C , f = 1MHz)  
Parameter  
Symbol  
Min  
Max  
Unit  
Input capacitance  
CIN1  
2.5  
3.5  
pF  
(A0~A11, BA0~BA1, CKE, CS , RAS , CAS , WE )  
CIN2  
2.5  
3.5  
pF  
Input capacitance (CLK, CLK )  
Data & DQS input/output capacitance  
Input capacitance (DM)  
COUT  
CIN3  
4.0  
4.0  
5.5  
5.5  
pF  
pF  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jun. 2009  
Revision : 1.4 5/48  
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