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M12S16161A-10TG 参数 Datasheet PDF下载

M12S16161A-10TG图片预览
型号: M12S16161A-10TG
PDF下载: 下载PDF文件 查看货源
内容描述: 512K X 16位X 2Banks同步DRAM [512K x 16Bit x 2Banks Synchronous DRAM]
分类和应用: 存储内存集成电路光电二极管动态存储器时钟
文件页数/大小: 28 页 / 866 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
SIMPLIFIED TRUTH TABLE  
M12S16161A  
COMMAND  
CKEn-1 CKEn  
DQM BA A10/AP A9~A0 Note  
CS RAS CAS WE  
Mode Register Set  
H
H
X
X
L
L
L
L
L
L
L
L
X
X
OP CODE  
OP CODE  
1,2  
1,2  
Register  
Refresh  
Extended Mode Register  
Set  
Auto Refresh  
H
L
3
3
H
L
L
L
H
X
X
Entry  
Self Refresh  
Exit  
L
H
L
H
X
L
H
X
H
H
X
H
3
L
H
H
H
X
X
X
X
X
X
3
Bank Active & Row Addr.  
V
V
Row Address  
Column  
L
4
Auto Precharge Disable  
Read &  
L
H
L
H
Address  
Column Address  
4,5  
Auto Precharge Enable  
Auto Precharge Disable  
Auto Precharge Enable  
H
L
H
(A0~A7)  
Column  
Address  
(A0~A7)  
4
4,5  
6
4
4
Write & Column  
Address  
H
X
L
H
L
L
X
V
Burst Stop  
H
H
X
X
L
L
H
L
H
H
L
L
X
X
X
Bank Selection  
Both Banks  
V
X
L
H
Precharge  
X
H
L
X
V
X
X
H
X
V
X
V
X
X
H
X
V
X
V
X
X
H
X
V
Clock Suspend or  
Active Power Down  
Entry  
Exit  
H
L
L
H
L
X
X
X
X
X
X
H
L
Entry  
H
Precharge Power Down Mode  
H
L
Exit  
L
H
X
V
X
DQM  
H
H
H
H
L
X
X
X
X
7
H
L
X
H
H
X
X
H
H
X
X
H
L
No Operation Command  
Deep Power Down Mode  
X
Entry  
Exit  
L
L
X
X
H
X
X
(V= Valid, X= Don’t Care, H= Logic High , L = Logic Low)  
Note:  
1. OP Code: Operation Code  
A0~ A10/AP, BA: Program keys.(@MRS). BA=0 for MRS and BA=1 for EMRS.  
2. MRS/EMRS can be issued only at both banks precharge state.  
A new command can be issued after 2 clock cycle of MRS.  
3. Auto refresh functions are as same as CBR refresh of DRAM.  
The automatical precharge without row precharge command is meant by “Auto”.  
Auto / self refresh can be issued only at both banks idle state.  
4. BA: Bank select address.  
If “Low”: at read, write, row active and precharge, bank A is selected.  
If “High”: at read, write, row active and precharge, bank B is selected.  
If A10/AP is “High” at row precharge, BA ignored and both banks are selected.  
5. During burst read or write with auto precharge, new read/write command can not be issued.  
Another bank read /write command can be issued after the end of burst.  
New row active of the associated bank can be issued at tRP after the end of burst.  
6. Burst stop command is valid at every burst length.  
7. DQM sampled at positive going edge of a CLK masks the data-in at the very CLK (Write DQM latency is 0), but  
makes  
Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jun. 2005  
Revision : 1.0 10/28