ESMT
M12L128324A
Operation temperature condition -40°C~85°C
PACKING
86 - LEAD
DIMENSIONS
TSOP(II)
DRAM(400mil)
Symbol
Dimension in mm
Dimension in inch
Min
Norm
Max
1.20
0.15
1.05
0.27
0.23
0.21
0.16
Min
Norm
Max
A
A1
A2
b
0.047
0.006
0.011
0.018
0.009
0.008
0.006
0.05
0.95
0.17
0.17
0.12
0.10
0.10
1.00
0.002
0.037
0.007
0.007
0.005
0.004
0.004
0.039
b1
c
0.20
0.008
c1
D
0.127
0.005
22.22 BSC
0.61 REF
11.76 BSC
10.16 BSC
0.50
0.875 BSC
0.024 REF
0.463 BSC
0.400 BSC
0.020
ZD
E
E1
L
0.40
0.60
0.016
0.024
L1
e
0.80 REF
0.50 BSC
0.031 REF
0.020 BSC
R1
R2
θ
0.12
0.12
0°
0.005
0.005
0°
0.25
0.010
8°
8°
0°
0°
θ 1
θ 2
θ 3
10°
10°
15°
15°
20°
20°
10°
10°
15°
15°
20°
20°
Elite Semiconductor Memory Technology Inc.
Publication Date: Feb. 2006
Revision: 1.1 47/49
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
