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M12L128168A-7TIG 参数 Datasheet PDF下载

M12L128168A-7TIG图片预览
型号: M12L128168A-7TIG
PDF下载: 下载PDF文件 查看货源
内容描述: 2M ×16位×4银行同步DRAM [2M x 16 Bit x 4 Banks Synchronous DRAM]
分类和应用: 存储内存集成电路光电二极管动态存储器
文件页数/大小: 22 页 / 361 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M12L128168A  
Operation temperature condition -40°C ~85°C  
Write command  
CLK  
( CS , CAS , WE = Low, RAS = High)  
H
CKE  
CS  
If the mode register is in the burst write mode, this command sets the burst start  
address given by the column address to begin the burst write operation. The first  
write data in burst can be input with this command with subsequent data on following  
clocks.  
RAS  
CAS  
WE  
A12, A13  
(Bank select)  
A10  
Add  
Col.  
Fig. 4 Column address and  
write command  
CLK  
Read command  
H
CKE  
( CS , CAS = Low, RAS , WE = High)  
CS  
RAS  
CAS  
Read data is available after CAS latency requirements have been met.  
This command sets the burst start address given by the column address.  
WE  
A12, A13  
(Bank select)  
A10  
Add  
Col.  
Fig. 5 Column address and  
read command  
CLK  
CBR (auto) refresh command  
H
CKE  
CS  
( CS ,RAS , CAS = Low, WE , CKE = High)  
This command is a request to begin the CBR refresh operation. The refresh  
address is generated internally.  
Before executing CBR refresh, all banks must be precharged.  
After this cycle, all banks will be in the idle (precharged) state and ready for a  
row activate command.  
RAS  
CAS  
WE  
A12, A13  
During tRC period (from refresh command to refresh or activate command), the  
M12L128168A cannot accept any other command.  
(Bank select)  
A10  
Add  
Fig. 6 Auto refresh command  
Elite Semiconductor Memory Technology Inc.  
Publication Date: Oct. 2007  
Revision: 1.2  
14/43