Ericsson Internal
E
EPEIHLI
PRODUCT SPEC.
1 (4)
Prepared (also subject responsible if other)
No.
5/1301- BMR 451 0402 Uen
26
Technical Specification
Approved
Checked
Date
Rev
Reference
EN/LZT 146 401 R4A May 2015
BMR 451 Digital PoL Regulators
Input 4.5-14 V, Output up to 40 A / 132 W
SEC/D (Lisa Li)
See §1
2015-05-18
A
© Ericsson AB
Soldering Information - Hole Mount through Pin in
Paste Assembly (Only for BMR451 0402)
Lead-free (Pb-free) solder processes
The product is capable for forced convection or vapor phase
reflow soldering in SnPb or Pb-free processes.
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, 217 to 221°C for
SnAgCu solder alloys) for more than 60 seconds and a peak
temperature of 245°C on all solder joints is recommended to
ensure a reliable solder joint.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a sufficiently
extended preheat time to ensure an even temperature across
the host PWB and it is also recommended to minimize the time
in reflow.
Maximum Product Temperature Requirements
Top of the product PWB near pin 10B is chosen as reference
location for the maximum (peak) allowed product temperature
(TPRODUCT) since this will likely be the warmest part of the
product during the reflow process.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may affect
long time reliability and isolation voltage.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
General reflow process specifications
Average ramp-up (TPRODUCT
SnPb eutectic
3°C/s max
Pb-free
)
3°C/s max
During reflow TPRODUCT must not exceed 225 °C at any time.
Typical solder melting (liquidus)
temperature
TL
183°C
221°C
Minimum reflow time above TL
Minimum pin temperature
Peak product temperature
60 s
60 s
Pb-free solder processes
TPIN
210°C
235°C
For Pb-free solder processes, the product is qualified for MSL 3
according to IPC/JEDEC standard J-STD-020C.
TPRODUCT 225°C
6°C/s max
260°C
Average ramp-down (TPRODUCT
)
6°C/s max
8 minutes
During reflow TPRODUCT must not exceed 260 °C at any time.
Maximum time 25°C to peak
6 minutes
Thermocoupler Attachment
Pin 8B for measurement of maximum product temperature
Temperature
TPRODUCT maximum
TPIN minimum
Pin
profile
TL
Product
profile
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Time
Minimum Pin Temperature Recommendations
Pin number 2B is chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
Pin 3A for measurement of minimum Pin (solder joint) temperature
TPIN
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in excess
of the solder melting temperature, (TL, 183°C for Sn63Pb37) for
more than 60 seconds and a peak temperature of 220°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of solder
paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be used,
if the products are kept in a controlled environment (dry pack
handling and storage) prior to assembly.
ERICSSON [ ERICSSON ]
