Ericsson Internal
E
EPETSCH
PRODUCT SPEC.
1 (4)
Prepared (also subject responsible if other)
No.
5/1301- BMR 451 Uen
24
Technical Specification
Approved
Checked
Date
Rev
Reference
EN/LZT 146 401 R4A May 2015
BMR 451 Digital PoL Regulators
Input 4.5-14 V, Output up to 40 A / 132 W
SEC/D (Julia You)
See §1
2010-03-10
B
© Ericsson AB
Soldering Information - Surface Mounting
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, 217 to 221°C for
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb and Pb-free
processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a sufficiently
extended preheat time to ensure an even temperature across
the host PCB and it is also recommended to minimize the time
in reflow.
Maximum Product Temperature Requirements
Top of the product PCB near pin 8B is chosen as reference
location for the maximum (peak) allowed product temperature
(TPRODUCT) since this will likely be the warmest part of the
product during the reflow process.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may affect
long time reliability and isolation voltage.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
Minimum Pin Temperature Recommendations
Pin number 3A is chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
During reflow TPRODUCT must not exceed 225 °C at any time.
Pb-free solder processes
For Pb-free solder processes, the product is qualified for MSL 3
according to IPC/JEDEC standard J-STD-020C.
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature, (TL, 183°C for
Sn63Pb37) for more than 30 seconds and a peak
temperature of 210°C is recommended to ensure a reliable
solder joint.
During reflow TPRODUCT must not exceed 260 °C at any time.
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
For dry packed products only: depending on the type of solder
paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be used,
if the products are kept in a controlled environment (dry pack
handling and storage) prior to assembly.
Using products in high temperature Pb-free soldering processes
requires dry pack storage and handling. In case the products
have been stored in an uncontrolled environment and no longer
can be considered dry, the modules must be baked according
to J-STD-033.
General reflow process specifications SnPb eutectic Pb-free
Average ramp-up (TPRODUCT
)
3°C/s max
183°C
3°C/s max
221°C
Typical solder melting
(liquidus) temperature
TL
Minimum reflow time above
TL
Thermocoupler Attachment
30 s
30 s
Pin 8B for measurement of maximum product temperature
Minimum pin temperature
Peak product temperature
Average ramp-down
TPIN
210°C
225°C
235°C
260°C
TPRODUC
T
6°C/s max
6 minutes
6°C/s max
8 minutes
(TPRODUCT
)
Maximum time 25°C to peak
Temperature
TPRODUCT maximum
TPIN minimum
Pin
profile
TL
Product
profile
Time in
reflow
Time in preheat
/ soak zone
Pin 3A for measurement of minimum Pin (solder joint) temperature
TPIN
Time 25°C to peak
Time
ERICSSON [ ERICSSON ]
