epc110
1.9
Bottom View
Top view
0.5
0.25
2.9 - 3.1
0.3
Figure 26: QFN-16: Mechanical dimensions
Reflow Solder Profile
For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec.
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
25
Datasheet epc110 - V2.1
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