epc110
Layout Information (all measures in mm,
)
CSP-10 Package
1.9 +0.0/-0.1
∅ 0.3
0.1524
∅ 0.12
Bottom View
Pin 1
0.5
0.5
Solder balls Sn97.5Ag2.5
0.15
0.5
0.5
2.5
no solder mask inside this area
Figure 23: CSP10: Mechanical dimensions
Recommendations for reliable soldering of solder balls:
Figure 24: CSP10: Layout recommendation
•
•
•
Use a pad layout similar as given in Figure 24. Notice that all tracks should go underneath the solder mask area.
Do not connect any pins direct pin to pin inside of the opening of the solder mask.
In case of the conductors are with a Au-Ni surface finish the preferred landing pad design for the solder balls will be covering the
round landing pad with a gold surface finish as a solderable area only.
QFN-16 Package
Opening in solder mask
Conductor layout
1 0
1 1
9
1 2
NC_GND
NC_GND
LED/SCK
EN/SI
GND
Top View
PD
NC_GND
NC_GND
Shielding of PD pin
1
2
4
3
Figure 25: QFN-16: Layout recommendation
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
24
Datasheet epc110 - V2.1
www.espros.ch
EPC [ ESPROS PHOTONICS CORP ]
