EN29SL800
Revisions List
Revision No Description
Date
A
B
Initial Release
2005/06/15
2006/04/14
1
Change the FBGA package dimension to
enhance the BGA substrate and ball strength
i. Package Thickness A : 1.10 mm to 1.31 mm
ii. Ball size b : 0.3 mm to 0.4 mm
TSOP package dimension change
R from 0.08 mm max. to 0.08~0.20 mm
Remove ,Unlock Bypass, Unlock Bypass
Program, and Unlock Bypass Reset, commands
from Table 9.
2
3
4
5
Remove description of Unlock Bypass
Remove regulated voltage version and
description
6
7
Correct manufacturer-id value in table 5, page 11
Modify test condition parameters in page 24,27
for 70ns read operation
i. Vcc=1.7-2.2 V
ii. Output Load 15pF
iii. Input / Output reference level 1/2 Vcc
C
D
1. Added WFBGA package option in page 1
2. Added WFBGA connection diagram in page 3
3. Added Figure 16 of WFBGA drawing in page 39
4. Added package code M for WFBGA in page 41
5. Changed typical active read current from 7 to 15
mA in page 1
2006/09/07
2006/11/06
6. Changed ICC1 typical from 7 to 15 mA;
ICC1 max from 15 to 30 mA in Table 7 of page 24
1. Added WLGA package option in page 1
2. Added WLGA connection diagram in page 3
3. Added Figure 17 of WLGA drawing in page 40
4. Added package code K for WLGA in page 42
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
43
Rev. D, Issue Date: 2006/11/06
EON [ EON SILICON SOLUTION INC. ]
