EN29SL800
ORDERING INFORMATION
EN29SL800
T
-
70
T
C
P
PACKAGING CONTENT
(Blank) = Conventional
P = Pb Free
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (-40°C to +85°C)
PACKAGE
T = 48-pin TSOP
B = 48-Ball Fine Pitch Ball Grid Array (FBGA)
0.80mm pitch, 6mm x 8mm package
M = 48-Ball Very-Very-Thin-Profile Fine Pitch
Ball Grid Array (WFBGA)
0.50mm pitch, 5mm x 6mm package
K = 48-Ball Very-Very-Thin-Profile Fine Pitch
Land Grid Array (WLGA)
SPEED
70 = 70ns
90 = 90ns
BOOT CODE SECTOR ARCHITECTURE
T = Top Sector
B = Bottom Sector
BASE PART NUMBER
EN = Eon Silicon Solution Inc.
29SL = FLASH, 1.8V Read Program Erase
800 = 8 Megabit (1024K x 8 / 512K x 16)
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
42
Rev. D, Issue Date: 2006/11/06
EON [ EON SILICON SOLUTION INC. ]
