EM6603
18.1 Ordering Information
Packaged Device:
Device in DIE Form:
EM6603 %%% SO24 B
EM6603 %%% WS 11
Customer Version:
Customer Version:
customer-specific number
customer-specific number
given by EM Microelectronic
given by EM Microelectronic
Package:
Die form:
SO24 = 24 pin SOIC
TP24 = 24 pin TSSOP
DL24 = 24 pin DIP (note 1)
WW = Wafer
WS = Sawn Wafer/Frame
WP = Waffle Pack
Thickness:
Delivery Form:
11 = 11 mils (280um), by default
27 = 27 mils (686um), not backlapped
(for other thickness, contact EM)
A = Stick
B = Tape&Reel (for SO24 and TP24 only)
Note 1: Please contact EM Microelectronic-Marin S.A. for availability of DIP package.
Ordering Part Number (selected examples)
Delivery Form/
Part Number
Package/Die Form
Thickness
Stick
EM6603%%%SO24A
EM6603%%%SO24B
EM6603%%%TP24B
EM6603%%%WS11
EM6603%%%WP11
24 pin SOIC
24 pin SOIC
Tape&Reel
Tape&Reel
11 mils
24 pin TSSOP
Sawn wafer
Die in waffle pack
11 mils
Please make sure to give the complete Part Number when ordering, including the 3-digit version. The version is made of 3
digits %%%: the first one is a letter and the last two are numbers, e.g. P01 , P12, etc.
18.2 Package Marking
DIP and SOIC marking:
TSSOP marking:
First line:
E M
6
6
0
3
0
% % Y
E
P
M
P
6
P
C
6
0
3
% %
Second line:
Third line:
P
P
P
P
P
P
P
P
P
P
P
P
C
P
P
P
Y
P
P
C C C C C C C C C C C
C C
Where: %% = last two-digits of the customer-specific number given by EM (e.g. 05, 12, etc.)
Y = Year of assembly
PP…P = Production identification (date & lot number) of EM Microelectronic
CC…C = Customer specific package marking on third line, selected by customer
18.3 Customer Marking
There are 11 digits available for customer marking on PDIP24 and SO24.
There are 4 digits available for customer marking on TSSOP24.
Please specify below the desired customer marking.
03/02 REV. G/439
36
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Copyright 2001, EM Microelectronic-Marin SA
EMMICRO [ EM MICROELECTRONIC - MARIN SA ]
