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DTP3006_13 参数 Datasheet PDF下载

DTP3006_13图片预览
型号: DTP3006_13
PDF下载: 下载PDF文件 查看货源
内容描述: P沟道60 V (D -S ) MOSFET无卤 [P-Channel 60 V (D-S) MOSFET Halogen-free]
分类和应用:
文件页数/大小: 7 页 / 1176 K
品牌: DINTEK [ DinTek Semiconductor Co,.Ltd ]
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SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
Parameter
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
c
Gate-Source Charge
c
Gate-Drain Charge
c
Gate Resistance
Turn-On Delay Time
c
Rise Time
c
Turn-Off Delay Time
c
Fall Time
c
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
V
DD
= - 20 V, R
L
= 2
I
D
- 10 A, V
GEN
= - 10 V, R
g
= 1
f = 1 MHz
0.5
V
DS
= - 20 V, V
GS
= - 10 V, I
D
= - 14 A
V
GS
= 0 V, V
DS
= - 20 V, f = 1 MHz
2765
330
280
67
13.5
14
2.5
10
11
42
12
5
20
20
63
20
ns
100
nC
pF
V
DS
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
DS
= 0 V, I
D
= - 250 µA
V
DS
= V
GS
, I
D
= - 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= - 60 V, V
GS
= 0 V
V
DS
= - 60 V, V
GS
= 0 V, T
J
= 125 °C
V
DS
= - 60 V, V
GS
= 0 V, T
J
= 150 °C
V
DS
-
10 V, V
GS
= - 10 V
V
GS
= - 10 V, I
D
= - 14 A
V
GS
= - 4.5 V, I
D
= - 12 A
V
DS
= - 20 V, I
D
= - 14 A
- 30
0.055
0.075
40
0.060
0.085
- 60
-1
- 2.5
± 250
-1
- 50
- 250
A
S
µA
V
nA
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
DTP3006
Drain-Source Body Diode Ratings and Characteristics
T
C
= 25 °C
b
Continuous Current
Pulsed Current
Forward Voltage
a
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
I
S
I
SM
V
SD
t
rr
I
RM(REC)
Q
rr
I
F
= - 10 A, dI/dt = 100 A/µs
I
F
= - 10 A, V
GS
= 0 V
- 0.8
38
2.3
40
- 36
- 100
- 1.5
57
3.5
60
A
V
ns
A
nC
Notes:
a. Pulse test; pulse width
300 µs, duty cycle
2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2