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SPECIFICATIONS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
V
DS
V
GS(th)
I
GSS
V
GS
= 0 V, I
D
= - 250 μA
V
DS
= V
GS
, I
D
= - 250 μA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 0 V, V
GS
= ± 12 V
V
GS
= 0 V
Zero Gate Voltage Drain Current
On-State Drain Current
a
I
DSS
I
D(on)
V
GS
= 0 V
V
GS
= 0 V
V
GS
= - 10 V
V
GS
= - 10 V
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V
V
GS
= - 10 V
V
GS
= - 4.5 V
Forward
Transconductance
b
g
fs
C
oss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
I
SM
V
SD
I
F
= - 3 A, V
GS
= 0 V
V
DD
= - 15 V, R
L
= 1.5
I
D
- 10 A, V
GEN
= - 10 V, R
g
= 1
f = 1 MHz
V
GS
= - 10 V
V
DS
= - 15 V, I
D
= - 10 A
Dynamic
b
Output Capacitance
Total Gate Charge
c
Gate-Source Charge
c
Gate-Drain Charge
c
Gate Resistance
Turn-On Delay
Rise Time
c
Turn-Off Delay Time
c
Fall Time
c
Pulsed Current
a
Forward Voltage
Time
c
V
GS
= 0 V
V
DS
= - 15 V, f = 1 MHz
-
-
-
-
6
-
-
-
-
-
-
712
75
9.5
19
12.82
38
82
134
178
-
- 0.75
890
113
-
-
20
57
123
201
214
- 84
- 1.2
A
V
ns
nC
pF
V
DS
= - 30 V
V
DS
= - 30 V, T
J
= 125 °C
V
DS
= - 30 V, T
J
= 175 °C
V
DS
-
5 V
I
D
= - 10 A
I
D
= - 10 A, T
J
= 125 °C
I
D
= - 10 A, T
J
= 175 °C
I
D
= - 7 A
- 30
- 1.5
-
-
-
-
-
- 30
-
-
-
-
-
-
- 2.0
-
-
-
-
-
-
0.0070
-
-
0.0160
32
-
- 2.5
±1
±2
-1
- 50
- 150
-
0.0085
0.0130
0.0150
0.0200
-
S
A
μA
V
mA
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
DTM4483
V
DS
= - 10 V, I
D
= - 10 A
Source-Drain Diode Ratings and Characteristics
b
Notes
a. Pulse test; pulse width
300 μs, duty cycle
2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2