DA14580
FINAL
Bluetooth Low Energy 4.2 SoC
7
Package Information
7.1 MOISTURE SENSITIVITY LEVEL (MSL)
The MSL is an indicator for the maximum allowable
time period (floor life time) in which a moisture sensi-
tive plastic device, once removed from the dry bag, can
be exposed to an environment with a maximum tem-
perature of 30 °C and a maximum relative humidity of
60 % RH. before the solder reflow process.
WLCSP packages are qualified for MSL 1.
QFN packages are qualified for MSL 3.
MSL Level
MSL 4
Floor Life Time
72 hours
MSL 3
168 hours
MSL 2A
MSL 2
4 weeks
1 year
MSL 1
Unlimited at 30 °C / 85 % RH
7.2 WLCSP HANDLING
Manual handling of WLCSP packages should be
reduced to the absolute minimum. In cases where it is
still necessary, a vacuum pick-up tool should be used.
In extreme cases plastic tweezers could be used, but
metal tweezers are not acceptable, since contact may
easily damage the silicon chip.
Removal will cause damage to the solder balls and
therefore a removed sample cannot be reused.
WLCSP is sensitive to visible and infrared light. Pre-
cautions should be taken to properly shield the chip in
the final product.
7.3 SOLDERING INFORMATION
Refer to the JEDEC standard J-STD-020 for relevant
soldering information.
This document can be downloaded from http://
www.jedec.org
Datasheet
Revision 3.4
09-Nov-2016
CFR0011-120-01
151 of 155
© 2014 Dialog Semiconductor
DIALOG [ Dialog Semiconductor ]
