Package Characteristics
Package Characteristics
PACKAGE TYPE
20L
Ceramic
LCC
20L CERDIP 20L CERDIP
GREEN
20L SOIC
20L SOIC
GREEN
Reference
(see ordering info)
20 CLCC
20 CERDIP
20 CERDIP
G
20 SOIC
20 SOIC G
MS-013-AE
MS-030-A-
AE
MS-030-A-
AE
JEDEC MO Reference
MO-047
MS-013-AE
THERMAL RESISTANCE:
TJA (4 layer PCB)
TJC
85 °C/W
30 °C/W
70 °C/W
28 °C/W
70 °C/W
28 °C/W
85 °C/W
30 °C/W
85 °C/W
30 °C/W
JEDEC Moisture
Sensitivity Level
Lead Finish Material /
JEDEC Pb-free code
Hermetic
Hermetic
Hermetic
MSL 1 /
250°C
SnPb
plate
na
MSL 1 /
250°C
Matte Sn
e3
(MSL)
SnPb
solder dip
na
SnPb
solder dip
na
SnAgCu
solder dip
e1
Pb-Free DESIGNATION
Not Pb-free
Not Pb-free
Pb free
Not Pb-free
RoHS
Compliant
20L SOIC ( – G and non - G ) Package
©2012 Device Engineering Inc
Page 9 of 11
DS-MW-03283-01 Rev L
12/12/2012
DEIAZ [ Device Engineering Incorporated ]
