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XB24CZ7RIS-004 参数 Datasheet PDF下载

XB24CZ7RIS-004图片预览
型号: XB24CZ7RIS-004
PDF下载: 下载PDF文件 查看货源
内容描述: XBee® /的XBee - PRO® ZB SMT射频模块 [XBee®/XBee-PRO® ZB SMT RF Modules]
分类和应用: 射频
文件页数/大小: 155 页 / 3791 K
品牌: DCD [ DIGITAL CORE DESIGN ]
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XBee®/XBee‐PRO® ZB SMT RF Modules 
Electrical Specifications for GPIO Pads
GPIO Electrical Specification
Output voltage for logic 1
Output source current for pad numbers 3, 4, 5, 10, 12, 14, 15,
16, 17, 25, 26, 28, 29, 30, and 32
Output source current for pad numbers 3, 4, 5, 10, 12, 14, 16,
17, 26, 28, 29, 30, and 33
Output source current for pad numbers 7, 8, 24, 31, and 33
Output sink current for pad numbers 7, 8, 24, 31, and 33
Total output current (for GPIO pads)
Value
0.82 x VCC (minimum)
4 mA
4 mA
8 mA
8 mA
40 mA
Hardware Specs for Programmable Variant
If the module has the programmable secondary processor, add the following table values to the specifications
listed on page 7. For example, if the secondary processor is running at 20 MHz and the primary processor is in
recieve mode then the new current value will be I
total
= I
r2
+ I
rx
= 14 mA + 9 mA = 23 mA, where I
r2
is the
runtime current of the secondary processor and I
rx
is the recieve current of the primary.
Specifications of the programmable secondary processor
Optional Secondary Processor Specification
Runtime current for 32k running at 20MHz
Runtime current for 32k running at 1MHz
Sleep current
For additional specifications see Freescale Datasheet and
Manual
Minimum Reset low pulse time for EM357
VREF Range
These numbers add to specifications
(Add to RX, TX, and sleep currents depending on
mode of operation)
+14mA
+1mA
+0.5A typical
MC9SO8QE32
+26S
1.8VDC to VCC
© 2010 Digi International, Inc.
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