DM9010BI
Industrial-temperature Single Chip Ethernet Controller with General Processor Interface
9.6.1 Signal Detect........................................................................................................................................................ 43
9.6.2 Adaptive Equalization .......................................................................................................................................... 43
9.6.3 MLT-3 to NRZI Decoder ...................................................................................................................................... 43
9.6.4 Clock Recovery Module ....................................................................................................................................... 43
9.6.5 NRZI to NRZ ........................................................................................................................................................ 43
9.6.6 Serial to Parallel.................................................................................................................................................. 43
9.6.7 Descrambler......................................................................................................................................................... 43
9.6.8 Code Group Alignment......................................................................................................................................... 44
9.6.9 4B5B Decoder...................................................................................................................................................... 44
9.7 10BASE-T OPERATION .................................................................................................................................................. 44
9.8 COLLISION DETECTION................................................................................................................................................. 44
9.9 CARRIER SENSE ............................................................................................................................................................ 44
9.10 AUTO-NEGOTIATION ................................................................................................................................................... 44
9.11 POWER REDUCED MODE............................................................................................................................................. 45
9.11.1 Power Down Mode............................................................................................................................................. 45
9.11.2 Reduced Transmit Power Mode.......................................................................................................................... 45
10. DC AND AC ELECTRICAL CHARACTERISTICS.................................................................................................. 46
10.1 ABSOLUTE MAXIMUM RATINGS (-40°C ~ +85°C)....................................................................................................... 46
10.1.1 OPERATING CONDITIONS ......................................................................................................................................... 46
10.2 DC ELECTRICAL CHARACTERISTICS (VDD = 3.3V) ................................................................................................... 46
10.3 AC ELECTRICAL CHARACTERISTICS & TIMING WAVEFORMS...................................................................................... 47
10.3.1 TP Interface
........................................................................................................................................................ 47
10.3.2 Oscillator/Crystal Timing
................................................................................................................................... 47
10.3.3 Power On Reset Timing...................................................................................................................................... 47
10.3.4 Processor I/O Read Timing ................................................................................................................................ 48
10.3.5 Processor I/O Write Timing................................................................................................................................ 49
10.3.6 External MII Interface Transmit Timing............................................................................................................. 50
10.3.7 External MII Interface Receive Timing .............................................................................................................. 50
10.3.8 MII Management Interface Timing..................................................................................................................... 51
10.3.9 EEPROM Interface Timing ................................................................................................................................ 51
11. APPLICATION NOTES ................................................................................................................................................ 52
11.1 NETWORK INTERFACE SIGNAL ROUTING .................................................................................................................... 52
11.2 10BASE-T/100BASE-TX HPAUTO-MDIX APPLICATION............................................................................................ 52
11.3 10BASE-T/100BASE-TX ( NON HPAUTO-MDIX TRANSFORMER APPLICATION ) ...................................................... 53
11.4 POWER DECOUPLING CAPACITORS.............................................................................................................................. 54
11.5 GROUND PLANE LAYOUT............................................................................................................................................ 55
11.6 POWER PLANE PARTITIONING ..................................................................................................................................... 56
11.7 MAGNETICS SELECTION GUIDE................................................................................................................................... 57
11.8 CRYSTAL SELECTION GUIDE............................................................................................................................................. 57
11.9APPLICATION OF REVERSE MII.......................................................................................................................................... 58
12. PACKAGE INFORMATION ........................................................................................................................................ 59
13. ORDERINGINFORMATION........................................................................................................................................... 60
Preliminary
4
Version: DM9010BI--DS-P01
January 12, 2010
DAVICOM [ DAVICOM SEMICONDUCTOR, INC. ]
