CYStech Electronics Corp.
TO-251 Dimension
A
B
C
D
F
3
E
K
2
1
J
G
Spec. No. : C817I3-H
Issued Date : 2003.04.02
Revised Date: 2009.02.04
Page:5/5
Marking:
Device
name
HFE rank
B772
□ □□
Date Code
I
H
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-251 Plastic Package
CYStek Package Code: I3
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.0177
0.0217
0.0354
0.0591
0.0177
0.0236
0.0866
0.0945
0.2441
0.2677
0.2677
0.2835
Millimeters
Min.
Max.
0.45
0.55
0.90
1.50
0.45
0.60
2.20
2.40
6.20
6.80
6.80
7.20
DIM
G
H
I
J
K
Inches
Min.
Max.
0.2559
-
-
*0.1811
-
0.0449
-
0.0346
0.2047
0.2165
Millimeters
Min.
Max.
6.50
-
-
*4.60
-
1.14
-
0.88
5.20
5.50
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: KFC; pure tin plated
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB772I3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
