7. Application Circuit
5.6V ZI
+
7.5V ZI
V-
3V
+
10μ
10μ
0.47μ
4M
0.1μ
0.1μ
μA/mA
μA
μA
V+
V+
CREF+
μA
900
90
0.1μ
100n
470n
90k
30k
100K
100K
(80) RANGE
HOLD
REL_ZERO
NC
mA
mA
CREF-
CINT (5)
CAZ
BUFF
RAZ
IVSH
IVSL (10)
OVX
OVH
OVSG
OR1
VR5 (15)
VR4
VR3
mA
9
VAHZ
(75) MAX/MIN
BKOUT
BUZOUT
BUZIN
ANNUNC
(70) BP1
BP2
10A
10A
0.99
0.01
5.6V ZI
V-
100K
100
220p
Ω
1.5K
PTC
99.5
1K
10K
BP3
BP4
SEG01
(65) SEG02
SEG03
V/Ω/
101K
VR2
1.111M
6K
TEST5
SEG04
ACVL (20)
ACVH
SEG05
SEG06
2K
(60) SEG07
SEG08
0.1μ
ADI
ADO
7.5K
1μ
1μ
88M
SEG09
SEG10
SEG11
+
7.5K
+
4.7μ
(55) SEG12
SEG13
D1
D2
ADOHZ
OPO (25)
OPIN+
OPIN-
PWD
SEG14
SEG15
SEG16
91K
10K
VRH
1μ
VR (30)
+
9K
100K
ADP
1μ
1K
+
Cp
V-
1.5K
PTC
C
Hz
Notes:
1. Most of pins are protected by the ESD protection circuits. However pins, V+, V-, AGND, DGND and
VR1 are not protected enough because the parasitic effect must be decrease. Therefore enough external
protection is needed for assembling, carrying and keeping. In addition, components connecting to these
unprotected pins have to be soldered on board before the IC is soldered.
2. Cp is the compensation capacitor for measuring capacitance. Its value depends on the parasitic
capacitor on the PCB board.
3. Light shielding for the diodes and Zeners.
4. Zener diodes in above circuit are used for IC protection, so MUST be soldered on PCB first.
v1.2
28
11/09/06
CYRUSTEK [ Cyrustek corporation ]
