PSoC® 3: CY8C32 Family
Data Sheet
13. Packaging
Table 13-1. Package Characteristics
Parameter
Description
Conditions
Min
–40
–40
–
Typ
25.00
–
Max
85
100
–
Units
°C
T
Operating ambient temperature
Operating junction temperature
Package θJA (48-pin SSOP)
Package θJA (48-pin QFN)
Package θJA (68-pin QFN)
Package θJA (100-pin TQFP)
Package θJC (48-pin SSOP)
Package θJC (48-pin QFN)
Package θJC (68-pin QFN)
Package θJC (100-pin TQFP)
A
T
°C
J
Tja
Tja
Tja
Tja
Tjc
Tjc
Tjc
Tjc
45.16
15.94
11.72
30.52
27.84
7.05
6.32
9.04
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Table 13-2. Solder Reflow Peak Temperature
Maximum Peak
Package
Maximum Time at Peak
Temperature
Temperature
30 seconds
30 seconds
30 seconds
30 seconds
48-pin SSOP
48-pin QFN
68-pin QFN
100-pin TQFP
260 °C
260 °C
260 °C
260 °C
Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Package
48-pin SSOP
48-pin QFN
68-pin QFN
100-pin TQFP
MSL
MSL 3
MSL 3
MSL 3
MSL 3
Document Number: 001-56955 Rev. *J
Page 109 of 119
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