CY8C29666-24PVXI 参数 Datasheet PDF下载

4.

Packaging Information

This chapter illustrates the packaging specifications for the CY8C29x66 PSoC device, along with the thermal impedances for each

package and the typical package capacitance on crystal pins.

Important Note

Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of

the emulation tools’ dimensions, refer to the document titled

PSoC Emulator Pod Dimensions

at

4.1

Packaging Dimensions

Figure 4-1. 28-Lead (300-Mil) Molded DIP

51-85014 *D

August 5, 2008

Document No. 38-12013 Rev. *J

38