CY8C24x23A Final Data Sheet
4. Packaging Information
4.2
Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package
8 PDIP
Typical θJA
*
123 oC/W
185 oC/W
109 oC/W
117 oC/W
81 oC/W
69 oC/W
101 oC/W
74 oC/W
22 oC/W
8 SOIC
20 PDIP
20 SSOP
20 SOIC
28 PDIP
28 SSOP
28 SOIC
32 MLF
* TJ = TA + POWER x θJA
4.3
Capacitance on Crystal Pins
Table 4-2: Typical Package Capacitance on Crystal Pins
Package
8 PDIP
Package Capacitance
2.8 pF
8 SOIC
2.0 pF
20 PDIP
20 SSOP
20 SOIC
28 PDIP
28 SSOP
28 SOIC
32 MLF
3.0 pF
2.6 pF
2.5 pF
3.5 pF
2.8 pF
2.7 pF
2.0 pF
September 8, 2004
Document No. 38-12028 Rev. *B
45
CYPRESS [ CYPRESS ]
