CY8C24x23 Final Data Sheet
4. Packaging Information
4.2
Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package
8 PDIP
Typical θJA
*
o
123 C/W
o
8 SOIC
185 C/W
o
20 PDIP
20 SSOP
20 SOIC
28 PDIP
28 SSOP
28 SOIC
32 MLF
109 C/W
o
117 C/W
o
81 C/W
o
69 C/W
o
101 C/W
o
74 C/W
o
22 C/W
* T = T + POWER x θJA
J
A
4.3
Capacitance on Crystal Pins
Table 4-2: Typical Package Capacitance on Crystal Pins
Package
8 PDIP
Package Capacitance
2.8 pF
8 SOIC
2.0 pF
20 PDIP
20 SSOP
20 SOIC
28 PDIP
28 SSOP
28 SOIC
32 MLF
3.0 pF
2.6 pF
2.5 pF
3.5 pF
2.8 pF
2.7 pF
2.0 pF
June 4, 2004
Document No. 38-12011 Rev. *F
40
CYPRESS [ CYPRESS ]
