7. Sales and Service Information
Cypress Semiconductor
198 Champion Court
San Jose, CA 95134
408.943.2600
Web Sites:
Company Information – http://www.cypress.com
Sales – http://www.cypress.com/aboutus/sales_locations.cfm
Technical Support – http://www.cypress.com/support/login.cfm
7.1
Revision History
Document Title:
CY8C21234, CY8C21334, CY8C21434, CY8C21534, and CY8C21634 PSoC Mixed-Signal Array Final Data Sheet
Document Number: 38-12025
Originof
Change
Revision ECN # Issue Date
Description of Change
New silicon and document (Revision **).
**
5/19/2004
HMT
SFV
227340
Updated Overview and Electrical Spec. chapters, along with revisions to the 24-pin pinout part.
Revised the register mapping tables. Added a SSOP 28-pin part.
*A
235992 See ECN
Changed title to include all part #s. Changed 28-pin SSOP from CY8C21434 to CY8C21534.
Changed pin 9 on the 28-pin SSOP from SMP pin to Vss pin. Added SMP block to architecture
diagram. Update Electrical Specifications. Added another 32-pin MLF part: CY8C21634.
*B
*C
248572 See ECN
277832 See ECN
SFV
HMT
Verify data sheet standards from SFV memo. Add Analog Input Mux to applicable pin outs.
Update PSoC Characteristics table. Update diagrams and specs. Final.
*D
*E
285293 See ECN
301739 See ECN
329104 See ECN
HMT
HMT
HMT
Update 2.7V DC GPIO spec. Add Reflow Peak Temp. table.
DC Chip-Level Specification changes. Update links to new CY.com Portal.
Re-add pinout ISSP notation. Fix TMP register names. Clarify ADC feature. Update Electrical
Specifications. Update Reflow Peak Temp. table. Add 32 MLF E-PAD dimensions. Add ThetaJC to
Thermal Impedance table. Fix 20-pin package order number. Add CY logo. Update CY copyright.
*F
352736 See ECN
HMT
Add new color and logo. Add URL to preferred dimensions for mounting MLF packages. Update
Transmitter and Receiver AC Digital Block Electrical Specifications.
*G
*H
*I
390152 See ECN
413404 See ECN
430185 See ECN
HMT
HMT
HMT
Clarify MLF thermal pad connection info. Replace 16-pin 300-MIL SOIC with correct 150-MIL.
Update 32-pin QFN E-Pad dimensions and rev. *A. Update CY branding and QFN convention.
Add new 32-pin 5x5 mm 0.60 thickness QFN package and diagram, CY8C21434-24LKXI. Update
thermal resistance data. Add 56-pin SSOP on-chip debug non-production part, CY8C21001-
24PVXI. Update typical and recommended Storage Temperature per industrial specs. Update
copyright and trademarks.
*J
677717 See ECN
HMT
Add CapSense SNR requirement reference. Add new Dev. Tool section. Add CY8C20x34 to
PSoC Device Characteristics table. Add Low Power Comparator (LPC) AC/DC electrical spec.
tables. Update rev. of 32-Lead (5x5 mm 0.60 MAX) QFN package diagram.
*K
Distribution: External/Public
Posting: None
January 12, 2007
© Cypress Semiconductor Corp. 2004-2007 — Document No. 38-12025 Rev. *K
41
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