enCoRe™ USB CY7C63722/23
CY7C63743
Table 28-1 below shows the die pad coordinates for the CY7C63722-XC. The center location of each bond pad is relative to the
bottom left corner of the die which has coordinate (0,0).
Table 28-1. CY7C63722-XC Probe Pad Coordinates in microns ((0,0) to bond pad centers)
X
Y
Pad Number
Pin Name
P0.0
P0.1
P0.2
P0.3
P1.0
P1.2
P1.4
P1.6
Vss
Vss
Vpp
VREG
XTALIN
XTALOUT
Vcc
(microns)
(microns)
1
2
3
4
5
6
7
8
788.95
597.45
406.00
154.95
154.95
154.95
154.95
154.95
154.95
154.95
363.90
531.70
1066.55
1210.75
1449.75
1662.35
1735.35
1752.05
1752.05
1752.05
1752.05
1752.05
1393.25
1171.80
980.35
2843.15
2843.15
2843.15
2687.95
2496.45
2305.05
2113.60
1922.05
1730.90
312.50
184.85
184.85
184.85
184.85
184.85
184.85
289.85
1832.75
2024.30
2215.75
2407.15
2598.65
2843.15
2843.15
2843.15
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
D–
D+
P1.7
P1.5
P1.3
P1.1
P0.7
P0.6
P0.5
P0.4
enCoRe is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document
may be the trademarks of their respective holders.
Document #: 38-08022 Rev. **
Page 57 of 58
© Cypress Semiconductor Corporation, 2002. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
CYPRESS [ CYPRESS ]
