CY7C1019DV33
Capacitance
[4]
Parameter
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
Test Conditions
T
A
= 25°C, f = 1 MHz, V
CC
= 3.3V
Max.
8
8
Unit
pF
pF
Thermal Resistance
[4]
Parameter
Θ
JA
Θ
JC
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test Conditions
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
SOJ
56.29
38.14
TSOP II VFBGA
62.22
21.43
36
9
Unit
°C/W
°C/W
AC Test Loads and Waveforms
[5]
ALL INPUT PULSES
90%
50
Ω
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
1.5V
Rise Time: 1 V/ns
Z = 50Ω
OUTPUT
3.0V
GND
10%
90%
10%
30 pF*
(a)
(b)
Fall Time: 1 V/ns
High-Z characteristics:
R1 317
Ω
3.3V
OUTPUT
5 pF
R2
351Ω
(c)
Notes
4. Tested initially and after any design or process changes that may affect these parameters.
5. AC characteristics (except High-Z) are tested using the load conditions shown in Figure (a). High-Z characteristics are tested for all speeds using the test load
shown in Figure (c).
Document #: 38-05481 Rev. *D
Page 4 of 11
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