CY7B923
CY7B933
Package Diagrams
28-Lead Plastic Leaded Chip Carrier J64
28-Lead Pb-Free Plastic Leaded Chip Carrier J64
MIN.
DIMENSIONS IN INCHES
MAX.
SEATING PLANE
PIN #1 ID
4
1
26
5
25
0.013
0.021
0.450
0.485
0.495
0.390
0.430
0.458
0.045
0.055
11
19
0.026
0.032
12
18
0.020 MIN.
0.450
0.458
0.090
0.120
0.165
0.180
0.485
0.495
51-85001-*A
28 Lead2(83-L0e0adM(30il0)-MSiOl) MICold-eSd2S1OIC S21
28-Lead Pb-Free(300-Mil) Molded SOIC S21
PIN 1 ID
14
1
MIN.
DIMENSIONS IN INCHES[MM]
MAX.
*
0.394[10.01]
0.419[10.64]
REFERENCE JEDEC MO-119
PACKAGE WEIGHT 0.85gms
0.291[7.39]
0.300[7.62]
PART #
15
28
0.026[0.66]
0.032[0.81]
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
SEATING PLANE
0.697[17.70]
0.713[18.11]
0.092[2.33]
0.105[2.67]
*
0.004[0.10]
0.0091[0.23]
0.050[1.27]
TYP.
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
*
0.004[0.10]
0.0125[3.17]
0.0118[0.30]
51-85026-*C
ESCON is a registered trademark of IBM. HOTLink is a registered trademark of Cypress Semiconductor. All product and company
names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-02017 Rev. *E
Page 32 of 33
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.