CG64xxAM Preliminary Data Sheet
4. Packaging Information
51-85077 *C
Figure 4-2. 20-Lead (210-MIL) SSOP
4.2
Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package
Typical θJA
186 oC/W
117 oC/W
*
8 SOIC
20 SSOP
* TJ = TA + POWER x θJA
4.3
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 4-2. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature*
Maximum Peak Temperature
240oC
240oC
260oC
260oC
8 SOIC
20 SSOP
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5oC
with Sn-Pb or 245+/-5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
May 24, 2005
Document No. 001-00353 Rev. **
23
CYPRESS [ CYPRESS ]
