EnerChip CC CBC3150
EnerChip CC CBC3150 PCB Layout Guidelines - Important Notice!
There are several PCB layout considerations that must be taken into account when using the CBC3150:
1. All capacitors should be placed as close as possible to the EnerChip CC. The flying capacitor connections
must be as short as possible and routed on the same layer the EnerChip CC is placed.
2. Power connections should be routed on the layer the EnerChip CC is placed.
3. A ground (GND) plane in the PCB should be used for optimal performance of the EnerChip CC.
4. Very low parasitic leakage currents from the VBAT pin to power, signal, and ground connections, can result
in unexpected drain of charge from the integrated power source. Maintain sufficient spacing of traces and
vias from the VBAT pin and any traces connected to the VBAT pin in order to eliminate parasitic leakage
currents that can arise from solder flux or contaminants on the PCB.
5. Pin 1 VBAT and Pin 4 VCHG must be tied together for proper operation.
6. There should be no traces, vias or connections under the CBC3150 exposed die pad.
7. When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside
of the package and all metal pads. Failure to observe this precaution can result in package cracking during
solder reflow due to the silk screen material interfering with the solder solidification process during cooling.
8. See Figure 12 for location and dimensions of metal pad placement on the PCB.
Figure 12: Recommended PCB Layout for the CBC3150-D9C Package (Dimensions in mm)
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