CPC7583
3.1.3 CPC7583M
28-Lead DFN Package
Recommended PCB Land Pattern
0.33 +0.07,-0.05
(0.013 +0.003, -0.002)
11.0
(0.433)
0.75
(0.030)
Pin 1
7.0
(0.276)
6.70
5.0 0.05
1.05
(0.197 0.002)
(0.264)
(0.045)
Pin 1
Bottom side
metallic pad
0.55 0.10
0.75
0.35
7.5 0.05
(0.03)
(0.022 0.004)
(0.016)
(0.296 0.002)
0.90 0.10
0.20
(0.008)
(0.036 0.004)
Seating Plane
Dimensions
mm
(inches)
0.02 +0.03, -0.02
(0.001 +0.0012, -0.001)
NOTE: Because the metallic pad on the bottom of the
DFN package is connected to the substrate of the die,
Clare recommends that no printed circuit board traces
cross this area to avoid potential shorting issues.
R06
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