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CPC1465 参数 Datasheet PDF下载

CPC1465图片预览
型号: CPC1465
PDF下载: 下载PDF文件 查看货源
内容描述: SHDSL / ISDN终端DC IC [SHDSL/ISDN DC Termination IC]
分类和应用: 综合业务数字网
文件页数/大小: 15 页 / 476 K
品牌: CLARE [ CLARE ]
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3.3.2 DFN  
B0=7.24 + 0.10  
(0.285 + 0.004)  
330.2 Dia  
(13.00 Dia)  
Pin 1  
Top Cover  
Tape Thickness  
0.102 Max  
(0.004 Max)  
W=16.00 + 0.30  
(0.630 + 0.012)  
P=12.00 + 0.10  
(0.472 + 0.004)  
A0=6.24 + 0.10  
(0.246 + 0.004)  
K0=1.61 + 0.10  
(0.063 + 0.004)  
Dimensions  
mm  
(inches)  
Embossed  
Carrier  
User Direction of Feed  
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2  
Embossment  
3.4 Soldering  
3.4.1 Moisture Reflow Sensitivity  
3.4.2 Reflow Profile  
Clare has characterized the moisture reflow sensitivity  
for this product using IPC/JEDEC standard  
For proper assembly, this component must be  
processed in accordance with the current revision of  
IPC/JEDEC standard J-STD-020. Failure to follow the  
recommended guidelines may cause permanent  
damage to the device resulting in impaired  
J-STD-020. Moisture uptake from atmospheric  
humidity occurs by diffusion. During the solder reflow  
process, in which the component is attached to the  
PCB, the whole body of the component is exposed to  
high process temperatures. The combination of  
moisture uptake and high reflow soldering  
performance and/or a reduced lifetime expectancy.  
temperatures may lead to moisture induced  
3.5 Washing  
delamination and cracking of the component. To  
prevent this, this component must be handled in  
accordance with IPC/JEDEC standard J-STD-033 per  
the labeled moisture sensitivity level (MSL), level 1 for  
the SOIC package, and level 3 for the DFN package.  
Clare does not recommend ultrasonic cleaning of this  
part.  
RoHS  
2002/95/EC  
Pb  
e3  
For additional information please visit www.clare.com  
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set  
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its  
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into  
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a  
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.  
Specifications: DS-CPC1465 - R02  
© Copyright 2008, Clare, Inc.  
All rights reserved. Printed in USA.  
4/16/08  
R02  
www.clare.com  
15  
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