3.3.2 DFN
B0=7.24 + 0.10
(0.285 + 0.004)
330.2 Dia
(13.00 Dia)
Pin 1
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00 + 0.30
(0.630 + 0.012)
P=12.00 + 0.10
(0.472 + 0.004)
A0=6.24 + 0.10
(0.246 + 0.004)
K0=1.61 + 0.10
(0.063 + 0.004)
Dimensions
mm
(inches)
Embossed
Carrier
User Direction of Feed
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
3.4 Soldering
3.4.1 Moisture Reflow Sensitivity
3.4.2 Reflow Profile
Clare has characterized the moisture reflow sensitivity
for this product using IPC/JEDEC standard
For proper assembly, this component must be
processed in accordance with the current revision of
IPC/JEDEC standard J-STD-020. Failure to follow the
recommended guidelines may cause permanent
damage to the device resulting in impaired
J-STD-020. Moisture uptake from atmospheric
humidity occurs by diffusion. During the solder reflow
process, in which the component is attached to the
PCB, the whole body of the component is exposed to
high process temperatures. The combination of
moisture uptake and high reflow soldering
performance and/or a reduced lifetime expectancy.
temperatures may lead to moisture induced
3.5 Washing
delamination and cracking of the component. To
prevent this, this component must be handled in
accordance with IPC/JEDEC standard J-STD-033 per
the labeled moisture sensitivity level (MSL), level 1 for
the SOIC package, and level 3 for the DFN package.
Clare does not recommend ultrasonic cleaning of this
part.
RoHS
2002/95/EC
Pb
e3
For additional information please visit www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specifications: DS-CPC1465 - R02
© Copyright 2008, Clare, Inc.
All rights reserved. Printed in USA.
4/16/08
R02
www.clare.com
15
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