DICE INFORMATION
NC
14
2
1
13
12
3
PAD
FUNCTION
PAD
FUNCTION
8
9
Output C
–Input C
+Input C
–VCC
+Input D
–Input D
Output D
1
2
3
4
5
6
7
Output A
–Input A
+Input A
+VCC
+Input B
–Input B
Output B
4
10
11
12
13
14
NC
NC
Substrate Bias: –VCC
NC: No connection
MECHANICAL INFORMATION
MILS (0.001")
MILLIMETERS
Die Size
Die Thickness
Min. Pad Size
108 x 108 ±5
20 ±3
2.74 x 2.74 ±0.13
0.51 ±0.08
0.10 x 0.10
NC
NC
4 x 4
5
11
Backing
None
6
10
NC
7
8
9
OPA404 DIE TOPOGRAPHY
TYPICAL PERFORMANCE CURVES
TA = +25°C, VCC = ±15VDC unless otherwise noted.
POWER SUPPLY REJECTION AND COMMON-MODE
REJECTION vs TEMPERATURE
INPUT CURRENT NOISE SPECTRAL DENSITY
100
110
105
PSR
10
100
CMR
1
95
90
0.1
1
10
100
1k
10k
100k
1M
–75
–50
–25
0
+25
+50
+75 +100 +125
Frequency (Hz)
Temperature (°C)
BIAS AND OFFSET CURRENT
vs TEMPERATURE
TOTAL INPUT VOLTAGE NOISE SPECTRAL DENSITY
AT 1kHz vs SOURCE RESISTANCE
1k
10nA
1nA
10nA
1nA
EO
RS
100
100
10
100
10
OPA404 + Resistor
Bias Current
10
1
Offset Current
1
1
Resistor noise only
0.1
0.1
100
1k
10k
100k
1M
10M
100M
–50
–25
0
+25
+50
+75
+100
+125
Source Resistance (Ω)
Ambient Temperature (°C)
®
4
OPA404
BB [ BURR-BROWN CORPORATION ]
