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OPA2604 参数 Datasheet PDF下载

OPA2604图片预览
型号: OPA2604
PDF下载: 下载PDF文件 查看货源
内容描述: 双路FET输入,低失真运算放大器 [Dual FET-Input, Low Distortion OPERATIONAL AMPLIFIER]
分类和应用: 运算放大器
文件页数/大小: 14 页 / 165 K
品牌: BB [ BURR-BROWN CORPORATION ]
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ABSOLUTE MAXIMUM RATINGS(1)  
PIN CONFIGURATION  
Power Supply Voltage ....................................................................... ±25V  
Input Voltage ............................................................. (V–)–1V to (V+)+1V  
Output Short Circuit to Ground ............................................... Continuous  
Operating Temperature ................................................. –40°C to +100°C  
Storage Temperature..................................................... –40°C to +125°C  
Junction Temperature .................................................................... +150°C  
Lead Temperature (soldering, 10s) AP ......................................... +300°C  
Lead Temperature (soldering, 3s) AU .......................................... +260°C  
Top View  
DIP/SOIC  
Output A  
–In A  
+In A  
V–  
1
2
3
4
8
7
6
5
V+  
Output B  
–In B  
+In B  
NOTE: (1) Stresses above these ratings may cause permanent damage.  
ORDERING INFORMATION  
PRODUCT  
PACKAGE  
TEMP. RANGE  
OPA2604AP  
OPA2604AU  
8-Pin Plastic DIP  
SO-8 Surface-Mount  
–25°C to +85°C  
–25°C to +85°C  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
PACKAGING INFORMATION  
Any integrated circuit can be damaged by ESD. Burr-Brown  
recommends that all integrated circuits be handled with ap-  
propriate precautions. Failure to observe proper handling and  
installation procedures can cause damage.  
PACKAGE DRAWING  
NUMBER(1)  
PRODUCT  
PACKAGE  
OPA2604AP  
OPA2604AU  
8-Pin Plastic DIP  
SO-8 Surface-Mount  
006  
182  
ESD damage can range from subtle performance degradation  
to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric  
changes could cause the device not to meet published speci-  
fications.  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix C of Burr-Brown IC Data Book.  
®
3
OPA2604  
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