PAD
FUNCTION
PAD
FUNCTION
10*
11
12
13
14
15
16
17
18
Common
Output
+VCC
Filter
–In
1
2
3
4
5
6
7
8
9
Offset Adjust
X10 Gain
X100 Gain
X1000 Gain
X1000 Gain Sense
Gain Sense
Gain Set
+In
Offset Adjust
(A1 Output)
(A2 Output)
CMR Trim
–VCC
* Glass covers upper one-third of this pad.
Substrate Bias: Electrically connected to –V supply.
NC: No Connection.
MECHANICAL INFORMATION
MILS (0.001")
MILLIMETERS
Die Size
Die Thickness
Min. Pad Size
142 x 104 ±5
20 ±3
3.61 x 2.64 ±0.13
0.51 ±0.08
0.10 x 0.10
4 x 4
Backing
Gold
INA102 DIE TOPOGRAPHY
TYPICAL PERFORMANCE CURVES
At +25°C and in circuit of Figure 2 unless otherwise noted.
GAIN vs FREQUENCY
COMMON-MODE REJECTION vs SOURCE IMBALANCE
120
80
VOUT = 0.1Vrms
G = 1000
60
40
20
0
G = 10 to 1000
100
G = 100
G = 10
G = 1
G = 1
80
RIMB
60
1% Error
20Vp-p
5Hz
10kΩ
40
–20
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency (Hz)
Source Resistance Imbalance (Ω)
COMMON-MODE REJECTION vs FREQUENCY
WARM-UP DRIFT vs TIME
120
100
80
50
40
30
20
10
0
G = 100
G = 1000
G = 10
G = 1
60
VIN = 20Vp-p
0Ω Source Imbalance
40
0
1
2
3
4
5
1
10
100
1k
Frequency (Hz)
Time (ms)
®
BB [ BURR-BROWN CORPORATION ]
