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ADS7863IDBQ 参数 Datasheet PDF下载

ADS7863IDBQ图片预览
型号: ADS7863IDBQ
PDF下载: 下载PDF文件 查看货源
内容描述: 双路, 1.5MSPS , 12位, 2 + 2通道,同步采样模拟数字转换器 [Dual, 1.5MSPS, 12-Bit, 2 + 2 Channel, Simultaneous Sampling ANALOG-TO-DIGITAL CONVERTER]
分类和应用: 转换器光电二极管
文件页数/大小: 30 页 / 663 K
品牌: BB [ BURR-BROWN CORPORATION ]
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ADS7863  
www.ti.com  
SBAS383JUNE 2007  
LAYOUT  
underneath (or next) to the ADC. Otherwise, even  
short undershoots on the digital interface with a  
value lower than –300mV will lead to conduction of  
ESD diodes, causing current flow through the  
substrate and degrading the analog performance.  
For optimum performance, care should be taken with  
the physical layout of the ADS7863 circuitry. This  
condition is particularly true if the CLOCK input is  
approaching the maximum throughput rate. The  
basic SAR architecture is quite sensitive to glitches  
or sudden changes on the power supply, reference,  
ground connections, and digital inputs that occur just  
prior to latching the output of the analog comparator.  
Therefore, driving any single conversion for an n-bit  
SAR converter, there are n windows in which large  
external transient voltages can affect the conversion  
result. Such glitches might originate from switching  
power supplies, nearby digital logic, or high-power  
devices. The degree of error in the digital output  
depends on the reference voltage, layout, and the  
exact timing of the external event. These errors can  
change if the external event also changes in time  
with respect to the CLOCK input.  
During the PCB layout, care should also be taken to  
avoid any return currents crossing any sensitive  
analog areas or signals. No signal must exceed the  
limit of –300mV with respect to the according ground  
plane.  
Supply  
The ADS7863 has two separate supplies, the BVDD  
pin for the digital interface and the AVDD pin for all  
remaining (analog) circuits.  
BVDD can range from 1.65V to 5.5V, allowing the  
ADS7863 to interface with all state-of-the-art  
processors and controllers. To limit the injection of  
noise energy from external digital circuitry, BVDD  
should be filtered properly. Bypass capacitors of  
0.1μF and 10μF should be placed between the BVDD  
pin and the ground plane.  
With this possibility in mind, power to the ADS7863  
should be clean and well-bypassed. A 0.1μF ceramic  
bypass capacitor should be placed as close to the  
device as possible. In addition, a 1μF to 10μF  
capacitor is recommended. If needed, an even larger  
capacitor and a 5or 10series resistor may be  
used to low-pass filter a noisy supply.  
AVDD is used to supply the internal analog circuitry.  
For optimum performance, a linear regulator (for  
example, the UA7805 family) is recommended to  
generate the analog supply voltage in the range of  
2.7V to 5.5V for the ADS7863 and the necessary  
analog front-end circuitry.  
If the reference voltage is external and originates  
from an operational amplifier, be sure that it can  
drive the bypass capacitor or capacitors without  
oscillation.  
Bypass capacitors should be connected to the  
ground plane such that the current is allowed to flow  
through the pad of the capacitor (that is, the vias  
should be placed on the opposite side of the  
connection between the capacitor and the  
power-supply pin of the ADC).  
Grounding  
The xGND pins should be connected to a clean  
ground reference. These connections should be kept  
as short as possible to minimize the inductance of its  
path. It is recommended to use vias connecting the  
pads directly to the ground plane. In designs without  
ground planes, the ground trace should be kept as  
wide as possible. Avoid connections that are too  
near the grounding point of a microcontroller or  
digital signal processor.  
Digital Interface  
To further optimize device performance, a resistor of  
10to 100can be used on each digital pin of the  
ADS7863. In this way, the slew rate of the input and  
output signals is reduced, limiting the noise injection  
from the digital interface.  
Depending on the circuit density on the board,  
placement of the analog and digital components, and  
the related current loops, a single solid ground plane  
for the entire printed circuit board (PCB) or a  
dedicated analog ground area may be used. In an  
instance of a separated analog ground area, ensure  
a low-impedance connection between the analog  
and digital ground of the ADC by placing a bridge  
24  
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