ABSOLUTE MAXIMUM RATINGS
V
EE
to Digital Common ....................................................... +V
DD
to –16.5V
V
DD
to Digital Common .............................................................. 0V to +7V
Analog Common to Digital Common ....................................................
±1V
Control Inputs (CE, CS, A
O
, 12/8, R/C)
to Digital Common .................................................. –0.5V to V
DD
+0.5V
Analog Inputs (Ref In, Bipolar Offset, 10V
IN
)
to Analog Common ......................................................................
±16.5V
20V
IN
to Analog Common ..................................................................
±24V
Ref Out .......................................................... Indefinite Short to Common,
Momentary Short to V
DD
Max Junction Temperature ............................................................ +165°C
Power Dissipation ........................................................................ 1000mW
Lead Temperature (soldering,10s) ................................................. +300°C
Thermal Resistance,
θ
JA
: Plastic DIPs ........................................ 100°C/W
SOIC ................................................... 100°C/W
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
ADS774JE
ADS774KE
ADS774JP
ADS774KP
ADS774JU
ADS774KU
SINAD
(1)
68dB
70dB
68dB
70dB
68dB
70dB
TEMPERATURE
RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
LINEARITY
ERROR
±1LSB
±1/2LSB
±1LSB
±1/2LSB
±1LSB
±1/2LSB
PACKAGE
28-Pin 0.3" Plastic DIP
28-Pin 0.3" Plastic DIP
28-Pin 0.6" Plastic DIP
28-Pin 0.6" Plastic DIP
28-Lead SOIC
28-Lead SOIC
PACKAGE DRAWING
NUMBER
(2)
246
246
215
215
217
217
NOTES: (1) SINAD is Signal-to-(Noise + Distortion) expressed in dB. (2) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-
Brown IC Data Book.
CONNECTION DIAGRAM
+5VDC Supply
(V
DD
)
–
12/8
CS
A
O
–
R/C
CE
NC*
2.5V Ref
Out
Analog
Common
2.5V Ref
In
V
EE
1
2
3
4
5
6
7
8
9
10
11
Control
Logic
Power-Up Reset
28
27
Nibble A
STATUS
DB11 (MSB)
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0 (LSB)
Digital
Common
26
25
24
23
Succesive Approximation Register
Clock
Three-State Buffers and Control
Nibble B
Nibble C
22
21
20
19
18
17
16
15
2.5V
Reference
12 Bits
12
Bits
Bipolar 12
Offset
10V Range 13
20V Range
14
–
CDAC
+
*Not Internally Connected
®
ADS774
4
BURR-BROWN [ BURR-BROWN CORPORATION ]
