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www.ti.com
SBAS308A − MAY 2004 − REVISED MARCH 2005
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE−LEAD
ADS5542IPAP
Tray, 160
HTQFP-64(2)
PowerPAD
ADS5542
PAP
−40°C to +85°C
ADS5542I
ADS5542IPAPR
Tape and Reel, 1000
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website
at www.ti.com.
Thermalpad size: 3.5mm x 3.5mm (min), 4mm x 4mm (max). θJA = 21.47°C/W and θJC = 2.99°C/W, when used with 2oz. copper trace and pad
soldered directly to a JEDEC standard 4 layer 3in x 3in PCB.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
(1)
over operating free-air temperature range unless otherwise noted
MIN TYP MAX
UNIT
PARAMETER
ADS5542
UNIT
Supplies
AVDD to AGND
DRVDD to DRGND
,
−0.3 to +3.7
V
Analog supply voltage, AVDD
Output driver supply voltage, DRVDD
Analog Input
3.0
3.0
3.3
3.3
3.6
3.6
V
V
Supply
Voltage
AGND to DRGND
0.1
V
V
V
V
(2)
Analog input to AGND
−0.3 to +3.6
−0.3 to DRVDD
−0.3 to DRVDD
−40 to +85
+105
Differential input range
2.3
VPP
V
Logic input to DRGND
(1)
Input common-mode voltage, VCM
Digital Output
1.47 1.57 1.67
Digital data output to DRGND
Operating temperature range
Junction temperature
°C
°C
°C
Maximum output load
Clock Input
10
pF
Storage temperature range
−65 to +150
ADCLK input sample rate (sine
wave) 1/tC
10
1
80 MSPS
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
Clock amplitude, sine wave,
3
VPP
%
(2)
differential
(3)
Clock duty cycle
50
(2)
For more detail, refer to Input Voltage Overstress in the
ApplicationInformation section.
Open free-air temperature range
−40
+85
°C
(1)
(2)
(3)
Input common-mode should be connected to CM.
See Figure 46 for more information.
See Figure 45 for more information.
2
BB [ BURR-BROWN CORPORATION ]
