ADS1274
ADS1278
www.ti.com
SBAS367–JUNE 2007
PowerPAD THERMALLY-ENHANCED
PACKAGING
die pad to be attached to the PCB using standard
flow soldering techniques. This configuration allows
efficient attachment to the PCB and permits the board
structure to be used as a heatsink for the package.
Using a thermal pad identical in size to the die pad
and vias connected to the PCB ground plane, the
board designer can now implement power packaging
without additional thermal hardware (for example,
external heatsinks) or the need for specialized
assembly instructions.
The PowerPAD concept is implemented in standard
epoxy resin package material. The integrated circuit
is attached to the leadframe die pad using thermally
conductive epoxy. The package is molded so that the
leadframe die pad is exposed at a surface of the
package. This design provides an extremely low
thermal resistance to the path between the IC
junction and the exterior case. The external surface
of the leadframe die pad is located on the printed
circuit board (PCB) side of the package, allowing the
Figure 91 illustrates a cross-section view of a
PowerPAD package.
Mold Compound
(Epoxy)
IC Die
Wire Bond
Wire Bond
Leadframe Die Pad
Exposed at Base of Package
Die Attach Epoxy
(thermally conductive)
Leadframe
Figure 91. Cross-Section View of a PowerPAD Thermally-Enhanced Package
39
Copyright © 2007, Texas Instruments Incorporated
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