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SBAS288D − JUNE 2003 − REVISED AUGUST 2004
(1)
ORDERING INFORMATION
PACKAGE
DESIGNATOR
PACKAGE
MARKING
TRANSPORT MEDIA,
QUANTITY
PRODUCT
ADS1255
ADS1256
PACKAGE-LEAD
ORDERING NUMBER
ADS1255IDBT
ADS1255IDBR
ADS1256IDBT
ADS1256IDBR
Tape and Reel, 250
Tape and Reel, 1000
Tape and Reel, 250
Tape and Reel, 1000
SSOP-20
DB
DB
ADS1255IDB
ADS1256IDB
SSOP-28
(1)
For the most current package and ordering information, refer to our web site at www.ti.com.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handledwith appropriate precautions. Failure to observe
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
proper handling and installation procedures can cause damage.
ADS1255, ADS1256 UNIT
AVDD to AGND
DVDD to DGND
AGND to DGND
−0.3 to +6
−0.3 to +3.6
V
V
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
−0.3 to +0.3
V
100, Momentary
10, Continuous
−0.3 to AVDD + 0.3
mA
mA
V
Input Current
Analog inputs to AGND
DIN, SCLK, CS, RESET,
SYNC/PDWN,
XTAL1/CLKIN to DGND
−0.3 to +6
V
Digital
inputs
D0/CLKOUT, D1, D2, D3
to DGND
−0.3 to DVDD + 0.3
V
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature (soldering, 10s)
+150
−40 to +105
−60 to +150
+300
°C
°C
°C
°C
(1)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional
operationof the device at these or any other conditions beyond
those specified is not implied.
2
BB [ BURR-BROWN CORPORATION ]
