AZP51
AZP52
AZP53
AZP54
PACKAGE DIAGRAM
V – SOT-23 6L
5
2.90±0.100
C
L
0.950
TYP.
0.950
TYP.
NOTE:
1. Dimensions and tolerances are as per ANSI
Y14.5M, 1982.
2. Package surface to be matte finish VDI 11~13.
3. Die is facing up for mold. Die is facing
down for trim/form, ie. reverse trim/form.
C
L
4. The footlength measuring is based on the
gauge plane method.
5. Dimension are exclusive of mold flash and gate burr.
6. Dimension are exclusive of solder plating.
0.350(MIN)
0.500(MAX)
(6 PLCS)
10° TYP.
(2 plcs)
SEATING PLANE
0.05(MIN)
0.15(MAX)
10° TYP.
(2 plcs)
10° TYP.
(2 plcs)
0°~3°
±0.10
0.20 BSC
Gauge Plane
0.45
0.127
5
10° TYP.
(2 plcs)
December 2009 * REV - 2
www.azmicrotek.com
8
AZM [ ARIZONA MICROTEK, INC ]
