10 - 30 SEC.
255 - 260 °C
3 °C/ SEC. MAX.
217 °C
200 °C
10 SEC. MAX.
6 °C/ SEC. MAX.
230°C MAX.
150 °C
4°C/SEC. MAX.
–3°C/SEC.
140-160°C
3 °C/ SEC. MAX.
4°C/SEC.
100 SEC. MAX.
60 - 120 SEC.
MAX.
OVER 2 MIN.
TIME
TIME
(Acc. to J-STD-020C)
Figure 7. Recommended reflow soldering profile.
Figure 8. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.0 (0.039)
1.2 (0.047)
0.2 (0.008)
1.2
(0.047)
1.2
(0.047)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
0.9
(0.035)
Figure 10. Recommended soldering pattern for HSMx-C170.
Figure 9. Recommended soldering pattern for HSMx-C110.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.8
(0.031)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
0.7
(0.028)
Figure 11. Recommended soldering pattern for HSMx-C190 and C191.
Figure 12. Recommended soldering pattern for HSMx-C150.
Note: All dimensions in millimeters (inches).
8
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
