DIM. C
(SEE TABLE 1)
4.00 (0.157)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
CARRIER TAPE
COVER TAPE
USER FEED
DIRECTION
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A DIM. B
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
DIM. C
HSMx-C110
POSITION IN
PART NUMBER
CARRIER TAPE
HSMx-C191 SERIES
HSMx-C190 SERIES
HSMx-C170 SERIES
HSMx-C110 SERIES
HSMx-C150 SERIES
1.86 (0.073)
1.75 (0.069)
2.30 (0.091)
3.40 (0.134)
3.50 (0.138)
0.89 (0.035)
0.90 (0.035)
1.45 (0.057)
1.70 (0.067)
1.88 (0.074)
0.87 (0.034)
0.90 (0.035)
0.95 (0.037)
1.20 (0.047)
1.27 (0.050)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
Figure 15. Tape dimensions.
END
START
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Sur fa ce
Mounting SMT LED Indica tor
Components.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
Baking is required under the
condition:
a) Humidity Indicator Card is
> 10% when read at 23± 5°C.
b) Device exposed to factory
conditions < 30°C/60% RH
more than 672 hours.
COVER TAPE.
Figure 16. Tape leader and trailer dimensions.
NOTES:
Baking recommended condition:
60 + /– 5˚ C for 20 hours.
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
10