CATHODE
MARK
LED DIE
Package Dimensions, continued
1.6 (0.063)
0.8 (0.031)
3.2 (0.126 )
2.0 (0.079)
DIFFUSED
EPOXY
POLARITY
0.6 (0.024)
1.1 (0.043)
PC BOARD
0.5 (0.020)
0.50 ± 0.2
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
(0.020 ± 0.008)
SOLDERING
TERMINAL
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C150
Device Selection Guide
Footprint
(mm)
AS AlInGaP
Amber
AS AlInGaP
Orange
AS AlInGaP
Red
TS AlInGaP
Red
Package
Description
[1,2]
1.6 x 0.8 x 0.8
2.0 x 1.25 x 0.8
3.2 x 1.0 x 1.5
1.6 x 0.8 x 0.6
3.2 x 1.6 x 1.1
HSMA-C190
HSMA-C170
HSMA-C110
HSMA-C191
HSMA-C150
HSML-C190
HSML-C170
HSML-C110
HSML-C191
HSML-C150
HSMC-C190
HSMC-C170
HSMC-C110
HSMC-C191
HSMC-C150
HSMZ-C190
HSMZ-C170
HSMZ-C110
Untinted, Diffused
Untinted, Diffused
Untinted, Nondiffused
Untinted, Diffused
Untinted, Diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings
T = 25°C
A
HSMA-C110/170/190/191/150
HSML-C110/170/190/191/150
HSMC-C110/170/190/191/150
Parameter
HSMZ-C110/170/190
Units
mA
mW
V
[1,2]
DC Forward Current
Power Dissipation
25
25
60
65
Reverse Voltage (I = 100 µA)
5
5
R
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
95
95
°C
–30 to +85
–40 to +85
–30 to +85
–40 to +85
°C
°C
See reflow soldering profile (Figure 7 & 8)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
3
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
